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Semiconductor Manufacturing and EMI

Reduction of electrical overstress (EOS) and error-free operation of equipment are the main drivers to reduce electromagnetic interference (EMI) in semiconductor manufacturing environment.  High precision, nearly-complete automation, premium value of manufactured products, and their long-term reliability expectations - all requires uninterrupted operation, minimum variations in process, reliable measurements, near-100% yield, and, critically, reduction of latent damage, i.e. failures in the field. EMI interferes with these requirements in different but similar ways in each segment of semiconductor manufacturing.  SEMI E176 Standard provides specific recommendations to semiconductor manufacturers on acceptable levels of EMI and on EMI mitigation.  Read more about SEMI E176 in this and this articles in inCompliance Magazine (both are in our Library).  OnFILTER' products help semiconductor manufacturers to comply with SEMI E176 and reduce influence of EMI.  

Wafer Manufacturing: Front End
Wafer-Reflection 3.JPG

Main EMI Challenges

  • Uninterrupted operation

  • Accurate metrology

  • Error-free data communication

  • Consistent process and "recipes"

  • Reduction of EOS

Device Manufacturing: Back End

Main EMI Challenges

  • Low EOS exposure to devices

  • Error-free device test

  • Uninterrupted operation

Relevant Products:

Practical Aspects of Managing EMI-Caused EOS in IC Handlers and Similar Equipment

The Implementation of SEMI E176: Guide to Assessing and Minimizing Electromagnetic Interference in a Semiconductor Manufacturing Environment

Presentation on SEMI EMC Standards

Dealing With EMI in Semiconductor Manufacturing, Part II: SEMI E176-1017 Standard

Electromagnetic Compliance - a View from the Field

EMI-Generated EOS in a Wire Bonder

Intel® Manufacturing Enabling Guide

Technical Articles
Questions?  Ask Us

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